... the other way.
ECOPLATER COPPER COMPACT E, EC
COPPER PLATING TANK FOR ROTOGRAVURE CYLINDERS
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-Compact design, low overall height
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-Simple operation by GALVACONTROL
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-Flexible cylinder holding device with ECOCLAMP or modular adapter system
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-Can be integrated into automatic production line
PATENTED ELECTROLYTE FLOW
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-Symmetrical flow of electrolyte
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-Controlled transport of anode sludge away from cylinder
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-Optimal anode geometry
ECOPLATER produces fine crystalline hard copper layers, which are ideal conditions for the electronic engraver. This state-of-the-art machinery is based on the latest innovations in gravure cylinder copper plating. In addition, the machinery has many economical aspects, such as:
- Defined layer purity and surface quality result in low diamond wear, thereby keeping production costs low
- Efficient current transfer results in consistent layer thickness
- Low energy consumption cut production costs
ANODE SHAPE
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-Concentric anode shape
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-Precise electrolyte flow
ANODE ADJUSTMENT
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-Concentric automatic anode adjustment
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-Optimized current flow towards cylinder
ANODE BASKETS
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-Titanium anode baskets
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-Symmetrical overflow of electrolyte
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-360° electrolyteoverfolw return
ECOCLAMP
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-Lightweight cylinder holder
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-Internal drive wheel and current transfer are bulidt into the machine
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-Simple design with easy fit
GALVACONTROL
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-PLC electronics with interface to remote control
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-Fully automatic process or manual operation
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-Adjustable production parameters
ADAPTER
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-Weight saving construction
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-Modular design
Plating time:
Current density:
Immersion:
Electrolyte temperature:
Copper hardness
Plating thickness tolerance:
Electrolyte filtration rate:
100 µm layer in 30 - 32 minutes
30 A/dm²
50 % of cylinder surface
30-34 °C ± 1,5 °C
HV 0,1 180-220 ±2,5 HV (with additive)
for 100 µm layer ± 3%
approx. 15 times per hour
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